Features
Cooling type:The method used to cool the device or to cool the air around the device.
Heatsink
Country of origin:Country where the device is made.
Taiwan
AMD Extended Profiles for Overclocking (EXPO):
Intel Extreme Memory Profile (XMP) version:
3.0
Intel Extreme Memory Profile (XMP):
Memory voltage:The voltage (V) of the memory in the device.
1.35 V
Memory clock speed:The frequency at which the memory (e.g. RAM) runs.
3000 MHz
CAS latency:Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
40
Memory form factor:Design of the memory e.g. 240-pin DIMM, SO-DIMM.
288-pin DIMM
Component for:What this product is used as a part of (component for).
PC
Memory data transfer rate:
6000 MT/s
Internal memory type:The type of internal memory such as RAM, GDDR5.
DDR5
Memory layout (modules x size):
2 x 32 GB
Internal memory:A computer's memory which is directly accessible to the CPU.
64 GB
Packaging data
Package weight:Weight of the packaged product.
130 g
Package height:The distance from the top to the bottom of the packaging.
162 mm
Package depth:The distance from the front to the back of the packaging.
131 mm
Package width:The distance from one side of the packaging to the other.
11 mm
Weight & dimensions
Weight:Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
37 g
Height:The measurement of the product from head to foot or from base to top.
35 mm
Depth:The distance from the front to the back of something.
135 mm
Width:The measurement or extent of something from side to side.
7 mm
